Connector with included filtered power delivery

ABSTRACT

A substrate carries a voltage regulator module and a connector. By co-locating a voltage regulator to a processor or other circuit requiring a regulated power supply, distributed inductance associated with conventional circuit traces is reduced, thereby lessening demands on a voltage regulator and improving regulated voltage. A connector on the substrate can include internal filter capacitors to stabilize the output voltage from a voltage regulator. When the substrate is mounted to a circuit board, addition capacitors can be provided above and/or below the circuit board to which the substrate can be connected attached.

REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority of U.S. Provisional PatentApplication Serial No. 60/359,548, filed Feb. 25, 2002.

BACKGROUND OF THE INVENTION

[0002] The present invention relates generally to methods and systems ofdelivering power to computer processors, and more particularly toapparatus and methods for delivering power to micro and other processorsto the base, and preferably the center of the processor.

[0003] The computer industry has seen a remarkable advancement over theyears. Every few years, semiconductor companies are developing fasterand more powerful chips, or processors, for use in desktop and notebookcomputers, as well as work stations. These more powerful processors haveto operate at reduced voltages and higher currents. The need forsupplying power to these processors presents design problems, especiallyin view of the high power requirements for processors, which may run ashigh as from about 200 amps to about 700 amps. One solution is toprovide power supplies and/or conductive paths on the base ormotherboard to which the processor is mounted. This is undesirablebecause the higher processor currents require the incorporation of largeand thick copper traces on the circuit board in order to minimizevoltage drop. This increases the cost of the motherboard. The tracesmust also be designed so as to provide very low loop inductance in orderto stabilize voltage level in a few clock cycles when the processoremerges from a “sleep” state and enters a “computing” state. The use ofadditional copper and the need for specific circuit board design servesto increase the cost and complexity of using the base board to supplypower.

[0004] A need therefore exists for a different way to provide power tothese new processors which does not complicate the construction of themotherboard.

SUMMARY OF THE INVENTION

[0005] A general object of the present invention is to provide a meansfor improved power delivery.

[0006] Another object of the present invention is to provide a powerdelivery system for a processor in which power is delivered to centerarea of the processor and from underneath the processor.

[0007] A further object of the present invention is to provide a powerdelivery system for a processor in which the system includes a voltageregulator module (“VRM”) positioned beneath the motherboard, i.e., onthe side of the motherboard that is opposite the processor, the VRMhaving means for conducting power directly to the center of theprocessor.

[0008] A still further object of the present invention is to provide aVRM having a body portion with an opening for receiving the processor,the VRM housing a plurality of conductive traces to define a series ofredundant power paths disposed around the processor perimeter, the VRMbody portion including a first substrate and a second substrate spacedapart therefrom, the second substrate having a plurality of contactsthat extend into the processor socket.

[0009] Yet another object of the present invention is to provide aprocessor power socket that includes a socket for attaching to themotherboard, a VRM with a first substrate for receiving a processorthereon, the first substrate having a plurality of power paths disposedtherein for providing a redundant power paths to the processor, thefirst substrate including a plurality of contacts, such as a pin, ballgrid or land grid array, formed thereon so that the second substrate isnot needed in the circuit path between the processor and themotherboard.

[0010] A yet further object of the present invention is to provide a VRMthat has an opening and plurality of leads disposed thereon around theopening, the opening receiving a processor and the leads extending fromthe top of the VRM into the top of the processor.

[0011] A still further object of the present invention is to provide apower delivery assembly for a processor for use with a motherboard whichincludes a socket for receiving a substrate therein, another substratefor receiving the processor and the substrate, and a VRM for attachingto the bottom of the motherboard, the VRM including a decoupling powersocket having a plurality of conductive power lugs, or blades, thatextend upwardly from the VRM through the motherboard, the socket and thetwo substrates to the center of the processor.

[0012] An additional object of the present invention is to provide apower delivery system as set forth above that utilizes only a singlesubstrate to which the processor is mounted and which is received withinthe processor socket, the power contacts from the decoupling powersocket extending through the motherboard, the socket and the firstsubstrate to the center of the processor.

[0013] These and other objects, features with advantages of the presentinvention will become apparent from the following detailed description,taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In the course of this detailed description, the reference will befrequently made to the attached drawings in which:

[0015]FIG. 1 is a schematic view of a typical pinout arrangement usedfor a processor;

[0016]FIG. 2 is an elevational diagrammatic view of a typical prior artpower delivery system to a processor accommodated in a PGA socket;

[0017]FIG. 3 is an exploded view of one embodiment of a power deliverysystem constructed in accordance with the principles of the presentinvention;

[0018]FIG. 4A is a plan view of a contact arrangement that may beutilized in the system of FIG. 3;

[0019]FIG. 4B is a plan view of another contact arrangement that may beutilized in the system of FIG. 3

[0020]FIG. 5 is a schematic elevational view of another embodiment of apower delivery system of the present invention;

[0021]FIG. 6 is a schematic elevational view of another embodiment of apower delivery system of the present invention;

[0022]FIG. 7 is a schematic elevational view of another embodiment of apower delivery system of the present invention;

[0023]FIG. 8 is a schematic elevational view of another embodiment of apower delivery system of the present invention, but locating the VRMbeneath the motherboard;

[0024]FIG. 9 is a schematic elevational view of a power delivery systemof the present invention utilizing a power decoupling socket incombination with a remote VRM;

[0025]FIG. 10 is an exploded view of a power delivery system of theinvention; and,

[0026]FIG. 11 is a schematic elevation view of a power delivery systemassembly that includes an integrated circuit connector having aninternally-mounted filter capacitor as well as filter capacitors mountedabove and below the surface of a circuit board to which the assembly ismounted.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027]FIG. 1 illustrates a typical pinout arrangement 20 as is found inan array-type processor package. This package would typically include asocket surrounding the pin arrangement 20 and a plurality of conductivecontacts 21-23 located therein. Each of these contacts has two opposingends, with one set of ends, that visible in FIG. 1 and being the topends that protrude into the socket for contact to opposing traces,leads, balls, etc. On the bottom of the chip package, the other set ofend that extend out from the socket. As seen in FIG. 1, the pinoutlocations include signal locations 21, power locations 22 and ground, orpower return, locations 23. As can be seen in FIG. 1, there are a numberof pins that are associated with the power aspect. The use of thepresent invention permits the elimination of a significant number of thepower pins in such an array so that they may be freed for use with othersignal aspects of the processor.

[0028]FIG. 2 illustrates a known power delivery system to a pin gridarray (“PGA”) in which a voltage regulator module (“VRM”) 25 in mountedon a circuit board 26 and which is connected to one or more conductivetraces 27 a, 27 b that are interconnected to the VRM and which typicallywill serve as “power out” and “power return” paths which arerespectively indicated in FIG. 2 by the (+) and (−) designations. Asocket 28 having a plurality of LGA contacts 29 may be mounted to thecircuit board 26. A processor 30 includes a semiconductor die 31 mountedto a package 32 and may include contacts such as BGA contacts 33disposed thereon that serve to connect the package 32 to a substrate,shown as a circuit board 36 which in turn has a series of conductivepins 36 thereon, typically arranged in the pattern of FIG. 1.

[0029] In such a prior art system, the VRM 25 takes up valuable space onthe circuit board 26 and the use of conductive traces 27 a, 27 b withinthe circuit board 256 can increase the cost of the overall system.

[0030]FIG. 3 is an exploded diagrammatic view of one general concept, orembodiment, of a power delivery system 100 constructed in accordancewith the principles of the present invention. In this system, thesemiconductor die 101 is mounted to a processor package 102 that in turnis mounted to a circuit board, or substrate, 103 which is receivedwithin a socket 104 that is mounted to a motherboard 105. The VRM 106 ismounted beneath the motherboard 105 and uses one or more conductors 107to convey power from the VRM to the processor 101, 102 through theintervening sockets with circuit boards. In this manner, the VRM isremoved from the area surrounding the circuit board to free up space onthe upper surface of the board. The location of the VRM beneath theboard shortens the current path to the processor.

[0031]FIGS. 4A and 4B illustrate two contact arrangements that may beused in the system 100 of FIG. 3. The arrangement includes traditionalgalvanic, i.e., “copper” contacts 110 for signal transmission andpreferably two galvanic power contacts 111 i.e., power out and returnthat are separated by an intervening insulator 112. This arrangementwill typically extend through the motherboard 105, socket 104 andsubstrate 103. FIG. 4B illustrates an arrangement that uses capacitivelycoupled contacts 114 that do not rely upon metal-to-metal contact, butwhich rely upon capacitance between the processor contacts 109 andconductive lands or pads (not shown) that are disposed on the undersideof the substrate 103 on the motherboard 105. A more detailed descriptionof this type of capacitive coupling arrangement may be found inapplicant's copending U.S. patent application Ser. No. 09/548,940, filedApr. 13, 2001 and U.S. Pat. No. 6,362,972, the disclosures of which arehereby incorporated by reference. The use of two single and relativelylarge power contacts advantageously reduces the number of power andground pins required on the processor base, thereby freeing more spacefor use as signal pins, and increasing the density of the processor'ssignal applications.

[0032] It should be noted that the systems of the present inventionprovide desirable low inductance power paths to the processor ratherthan the high inductance paths of the prior art as exemplified in FIG. 2that utilize the substrate. With the use of one or two power controls,or legs such as those shown in FIGS. 3, 4A and 4B, the number of powerpins may be reduced from the arrangement of FIG. 1 so that more signalpins may be utilized on the processor and in the socket.

[0033]FIG. 5 schematically illustrates another embodiment of a powerdelivery system 140 of the invention. A processor socket 141 is mountedto the motherboard 142 and in designed to receive a processor packagetherein. The processor 143 is mounted to a first substrate 144 that hassuitable conductive contacts associated therewith, such as a BGA 145.This assembly of the processor and first substrate is received within arecess, or opening, 146 of a VRM 147. The VRM 147 has a series of leads148 that may be contacted to a second, pinned substrate 149. The leads148 are connected to traces 150 disposed in or on the second substrate149 which lead to a center lead, or leads 151 that extend up through thefirst substrate 144 into contact with the processor 143. These leads 151may be galvanic or capacitive leads. Power is supplied to the processor143 by these leads 151 from the VRM 147, thereby increasing the numberof pins 154 on the substrate 149 that may be used as signal pins formating with the socket 141.

[0034]FIG. 6 illustrates another embodiment of a power delivery system160 of the invention. This system differs from the system 140 of FIG. 5in that the leads 151 of the VRM 147 mate with leads in the firstsubstrate. In other words the first substrate 144 and the VRM (147)cooperate to provide power rather than the VRM and first and secondsubstrates of the system 140. In both systems, the leads are provided ina redundant manner and their paths are preferably distributed around theprocessor 143. In this system 160, the second substrate 149 and the BGA(145) are removed from the power transmission path. The VRM and thesubstrates may be interfittingly formed together as a power “socket”.

[0035]FIG. 7 illustrates another embodiment of a power delivery system170 where the VRM 147 is provided with leads 171 that extend from it tothe processor 143, and preferably along the top surface thereof, asillustrated. In this type of system, the two substrates 144, 149 and theBGA 145 are removed from the power delivery path.

[0036]FIG. 8 illustrates another power delivery system 180 in which theVRM 147 is mounted beneath the motherboard 142. The VRM may include apower decoupling socket 181 of the types that are disclosed inapplicant's copending patent application Ser. No. 10/255,376 filed Sep.26, 2002, the disclosure of which is hereby incorporated by reference.In this system, the power leads 151 take the form of large lugs 182which may, as illustrated in the insert view 143 a, be formed as part ofthe processor package itself with the lugs 182 and surrounding pinsdepending downwardly therefrom which are received in respective openingsin the motherboard ′42 and the socket 141. Although the socket 141 shownin FIG. 8 is depicted as a PGA, it may include an LGA or other style ofsocket. The processor package may, as shown at 143 a, include twosubstrates 144 and 149, or it may include as shown in insert view 143 b,only a single substrate 144.

[0037]FIG. 9 illustrates another power delivery system 190 in which theVRM is remotely located away from the socket 141 and preferably on themotherboard 142. The power decoupling socket 181 is located beneath themotherboard and may receive its power from a lead, or cable 192, thatleads to the VRM. The processor 143 may have the power lugs 182 formedwith it as shown in 143 b of FIG. 9. This illustrates a dual powersupply configuration where power is supplied to the processor from boththe top and the bottom of the motherboard.

[0038]FIG. 10 illustrates another arrangement 200 for use with powerdelivery systems of the invention. In this arrangement, an LGA packagedprocessor 202 may be packaged in an LGA substrate 204 with LGA padsformed on its bottom surface and a select number of power pins 205formed thereon. A second intervening substrate 206 with conductive lands208 may have a general opening 209 formed in its center thataccommodates the passage of the power pins 205 therethrough. A series ofposts 210 may be provided that extend through the second substrate 206via openings 211 therein and may be used to clamp the entire assemblytogether. These posts 210 fit through openings 211 and extend up from aLGA backing board 215. These posts 210 may be used to clamp the LGApackage into the assembly as well as conduct current from a VRM (notshown). The LGA backing plate may have a sandwich-style constructionwith interleaved layers of conductive material (copper) and dielectricmaterial with a series of center contacts 216 illustrated as conductiveposts with center holes 217 that receive and engage the power pins 205.These center posts 216 are in turn connected to power out and returnsources.

[0039]FIG. 11 illustrates an alternate embodiment of the invention inthe form of a power delivery system assembly 300 that provides aregulated voltage to a integrated circuit package at reduced inductancealong the power supply traces between a voltage regulator (“VRM”) and aninstalled integrated circuit, or processor that is mounted to amotherboard. The power delivery system assembly 300 illustrated includesan integrated circuit connector of die 302; a substrate 308; and, a VRM310. Electrical contacts on the bottom of the substrate 308 allowcircuitry mounted on the substrate 308 (e.g., an integrated circuitwithin the connector 302 and the VRM) to be electrically connected toother circuitry (not shown) on a circuit board 320 to which the assembly300 can be mounted. The VRM is shown mounted above the processor and itconveys power to the processor by way of contacts 330 that extend fromthe VRM to conductive traces on the substrate 308, which traces lead tothe bottom of the processor connector 302 to define a first path forpower transmission, PI that is shown in bold in FIG. 11.

[0040] In FIG. 11, the first integrated circuit connector, or die 302,has a base, or lower face 304, that is adjacent to or which “faces” anupper or “first” side 306 of the underlying substrate 308. The substrate308 is preferably made of an electrically non-conductive material suchas, but not limited to, glass or phenolic resin, ceramic, et al. As iswell-known in the art, the substrate 308 can include one or moreconductive traces, i.e., metallic strips or bands, which are attached toa surface of the substrate 308 or which run along the interior of thesubstrate 308.

[0041] Inasmuch as integrated circuits may be fabricated with theirpower connections located on the package bottom, the integrated circuitconnector 302 includes at least one electrical contact 312 that iselectrically coupled to an electrical conductor 314 that extends throughthe substrate 308 to its lower face or surface. As shown in FIG. 11, thecontacts are shown in touching or intimate contact. It will beunderstood, however, that such contact may be effected by capacitivecoupling as is shown and described in the aforementioned applicationSer. No. 09/548,940 and U.S. Pat. No. 6,362,972. A second electricalcontact 316 on the integrated circuit connector 308 is electricallycoupled to a second electrical conductor 318 through the substrate 308.

[0042] The electrical conductors 314 and 318 may also extend through thesubstrate 308 from the top surface to the bottom surface thereof so thatthey can be electrically connected to complementary conductors on acircuit board 320 via a second connector 322 that is sized andconfigured to accept electrical contacts that are on the second or lowerface of the substrate 308 but which are not shown in FIG. 11. Such asecond connector 322 preferably takes the form of a processor socketthat is mounted to the motherboard 320 and connected to various circuitsthereon. In a preferred embodiment, the first connector 302 includes atleast one filter capacitor (not shown) that may be embedded with theconnector as described in the aforementioned copending patentapplication, Ser. No. 10/255,376, and is electrically connected acrossthe conductors 314 and 318, by way of conductive traces or the like, soas to provide smoothing of the voltage variations that occur when anintegrated circuit within the connector transitions between a low-poweroperation mode (e.g., a “sleep” or “stand-by” state) to an active orhigh-power consumption mode state. Such a filter capacitor can bereadily molded into or mounted into the connector 302 to provideadditional power supply filtering where it is most effective, i.e., nearto the load represented by an integrated circuit, such as a processor,in the socket 302.

[0043] A second connector 322 mounted on the circuit board 320 can alsoinclude at least one internal capacitor 324, the function of which is toprovide power supply filtering for the voltage regulator module 310 thatis mounted to the first or upper face of the substrate. The internalcapacitor 324 provides filtering by virtue of its connection across theelectrical traces or conductors that extend from the voltage regulatormodule 310 to the conductors 312 and 316 that extend through thesubstrate 308. Alternatively, the capacitor 324 may be located on themotherboard.

[0044] The capacitor located within the connector 302 and which iselectrically connected across the output terminals of the voltageregulator module 310 and other capacitors across the power supply leadsfrom a voltage regulator module provide enhanced power supply filteringand power storage. As is well-known in the electrical arts, increasedfilter capacitance provides more stable output voltages. Two capacitorswill usually enable the provision of increased capacitance over that ofa single capacitor to thereby provide enhanced filtering of power supplycurrent and with minimal distributed inductance by being electricallyclose to the voltage regulator module as well as providing a parallelcurrent path that has lower inductance, whereby the power supply voltageto an integrated circuit such as a processor, when mounted in theconnector 302 will be provided with a more well-regulated supplyvoltage.

[0045] As shown in FIG. 11, the substrate 308 can be mechanically andelectrically mounted to a connector 322 that is attached to a circuitboard 320. The connector 322 includes electrical signal paths thatincludes electrical contacts (not shown) on its upper surface thatreceive and mate with corresponding contacts on the lower or bottomsurface of the substrate 308. The electrical contacts on the connector322 and the substrate 308 enable circuitry mounted on the substrate 308,such as an integrated circuit, or chip in the connector 302, to beelectrically connected to other circuitry (not shown) on the circuitboard 320.

[0046] The circuit board 320 includes at least two conductors, shown aspower lugs or plated through-hole via 340 and 342. The power lugs/vias340 and 342 extend completely through the circuit board 320 from theupper surface 321 to the lower surface 323 thereof where another filtercapacitor 344 may be coupled across the power lugs/vias 340 and 342.These power lugs may be connected to the chip connector contacts 312,316 or to the conductors 314, 316 in the substrate, as well as connectdirectly to the chip through the connector 302.

[0047] The invention contemplates the use of at least one capacitor 324or both capacitors 344 to assist in the provision of power to theprocessor. Where one capacitor is used, it is preferred to use it in thelocation of capacitor 324, close to the bottom of the processor in orderto provide a low inductance power path. However, when two suchcapacitors 324, 344, are used, they are connected together in parallelas illustrated so as to take advantage of the reduced inductance thatcomes from a parallel connection.

[0048] By using the structure depicted in FIG. 11, a voltage regulatormodule 310 can be physically positioned close to an electronic devicethat requires regulated power, thereby minimizing distributed inductanceassociated with longer circuit board traces. In addition to providingregulated power and reduced inductance, the structure of FIG. 11provides increased capacitance and therefore greater filtering of theoutput voltage from the VRM, further improving the stability of thevoltage output from the VRM. The VRM providers power to the filteringand storage capacitors and charges them so that they may be discharged,or drawn upon by the processor, during certain operations of theprocessor, such as start up and others. The connection of the capacitors324, 244 provides a second power path P2 along which power may betransmitted to the processor, and this second power path is arranged inparallel to the first power path P1 so that they provide a lowinductance source of power. They also cooperate with the VRM tosignificantly reduce the lag time the processor incurs when drawingpower.

[0049] In a preferred embodiment, the contacts to the integrated circuitare through the underside or base of the device. Accordingly, theconnector 302 includes electrical contacts that provide such power tothe underside or base-located power terminals of an integrated circuit.Also, in the preferred embodiment

[0050] It will be understood that the invention may be embodied in otherspecific forms without departing from the spirit thereof. The presentexamples and embodiments, therefore, are to be considered in allrespects as illustrative and not restrictive, and the invention is notto be limited to the details given herein.

What is claimed is:
 1. An assembly providing a regulated voltage to aintegrated circuit package on a substrate comprising: a substrate havingfirst and second sides, said substrate further having a first and secondelectrical conductors that extend through said substrate from said firstside to said second side and that carry electric current from a powersupply; a first integrated circuit connector having a base that facesthe first side of the substrate, said first integrated circuit connectorbeing mounted to the first side of said substrate and further having afirst electrical contact that is electrically coupled to said firstelectrical conductor and further having a second electrical contact thatis electrically coupled to said second electrical conductor, saidconnector further including a capacitor located within said firstintegrated circuit connector, operatively coupled between said first andsecond electrical contacts.
 2. The assembly of claim 1, furthercomprising a voltage regulator module operatively attached to saidsubstrate and having an output terminal coupled to said first electricalconductor of said substrate and having a reference potential terminalcoupled to said second electrical conductor of said substrate.
 3. Theassembly of claim 2, further including an integrated circuit,operatively coupled to said voltage regulator module such that saidvoltage regulator module and said capacitor provide filtered power tosaid integrated circuit.
 4. The assembly of claim 3, wherein saidintegrated circuit is a processor.
 5. An assembly for providing aregulated voltage to a integrated circuit package on a substratecomprising: a substrate having first and second sides, said substratefurther having a first and second electrical conductors that extendthrough said substrate from said first side to said second side and thatcarry electric current from a power supply; a first integrated circuitconnector having a base that faces the first side of the substrate, saidfirst integrated circuit connector being mounted to the first side ofsaid substrate and further having a first electrical contact that iselectrically coupled to said first electrical conductor and furtherhaving a second electrical contact that is electrically coupled to saidsecond electrical conductor; first capacitor, located proximate to thefirst side of the substrate and electrically connected across said firstand second conductors; a second capacitor, located proximate to thesecond side of the substrate and electrically connected across saidfirst and second conductors; whereby said first and second capacitorsare connected in parallel across said first and second conductors andfilter electric power provided to an integrated circuit installed intosaid first integrated circuit connector.
 6. The assembly of claim 5,further including a voltage regulator module operatively attached tosaid substrate and having an output terminal coupled to said firstelectrical conductor of said substrate and having a reference potentialterminal coupled to said second electrical conductor of said substrate.7. The assembly of claim 6, further including an integrated circuit,operatively coupled to said voltage regulator module such that saidvoltage regulator module and said capacitor provide filtered power tosaid integrated circuit.
 8. The assembly of claim 7, wherein saidintegrated circuit is a processor.
 9. An assembly for providing aregulated voltage to a integrated circuit (“IC”) package, comprising: asubstrate having a body with first and second sides, the substratefurther including first and second electrical conductors supportedthereby, the first and second conductors extending through saidsubstrate from said first side to said second side, said substratefurther including a plurality of electrical contacts disposed on saidsecond side for electrically coupling circuitry mounted on saidsubstrate to circuitry on an opposing circuit board, said substratestill further a plurality of first contacts electrically coupled to saidsubstrate first and second conductors; a voltage regulator module(“VRM”) connected to said substrate first side and having at least oneoutput terminal electrically coupled to said substrate first conductorand a reference potential terminal electrically coupled to saidsubstrate second conductor, said first and second conductors carryingelectric current from a power supply associated with the VRM to an ICpackage mounted on said substarte; a first capacitor disposed alongsubstrate second side and electrically coupled across said first andsecond electrical conductors for storing power and for filteringelectrical current.
 10. The assembly of claim 9, wherein said means forconnecting to an IC package includes an IC connector that is operativelycoupled to said VRM and first capacitor such that said VRM and firstcapacitor provide filtered power to said integrated circuit package. 11.The assembly of claim 10, wherein said IC connector supports aprocessor.
 12. The assembly of claim 9, further including a circuitboard having first and second sides, the first side of which has aplurality of electrical contacts, each of which is operatively coupledto corresponding ones of the plurality of electrical contacts on saidsecond side of said substrate, said circuit board including a firstpower conductor that extends completely through said circuit board andwhich is electrically coupled to said first electrical conductor of saidsubstrate, said circuit board having a second power conductor thatextends completely through said circuit board and is electricallycoupled to said second electrical conductor of said substrate, a secondcapacitor, mounted to said second side of said circuit board andelectrically coupled across said first and second power conductors, saidfirst and second capacitors being charged by current from said VRM anddischarging power to said IC package connector and an IC supportedthereby.
 13. The assembly of claim 12, further including a thirdcapacitor located within said integrated circuit connector and which iselectrically coupled across said first and second power capacitors. 14.The assembly of claim 12, wherein said first and second power conductorsinclude plated vias extending through said substrate
 15. The assembly ofclaim 12, wherein said first and second power conductors include solidconductive terminals extending through said substrate.